DS Smith and AFCO to raise awareness of the importance of cardboard packaging

The investment is part of our Packaging’s ambitious growth strategy in East Europe, driving leadership in sustainable packaging solutions across the region and creating value for our customers and partners. The first steps have already been taken by harmonising the business processes of both sites, including quality management and system standardiation. These initiatives are supported by investments in new machinery at both sites increasing quality, productivity as well as innovation capabilities. Reinier Schlatmann, DS Smith Regional Managing Director East Europe: "Our investments in technology, automation, and process improvement, enable DS Smith to drive innovation in packaging solutions. With a strong focus on the transition towards a circular economy, we are reshaping the industry and supporting customer sustainability goals at the same time. DS Smith's commitment in this respect is supported by our development of corrugated packaging that offers alternatives for problematic plastics. The investments in Austria significantly strengthen our position in the market and make a long-term contribution to the environment and economy.”

Dublin, Ireland-based Smurfit Kappa Group is partnering with Silicon Valley printing technology company Electronics For Imaging, Inc. to establish an efficient, robust digital corrugated packaging production offering with the installation of an EFI™ Nozomi C18000 single-pass LED inkjet corrugated packaging press. As a result of this partnership, Smurfit Kappa, one of the top innovators in packaging, and main driving force of digital print technology in Europe, will establish leaner and more-effective processes to deliver ready-to-sell high quality print packaging that will provide its customers maximum brand benefit in the retail store. “This digital printing partnership with EFI reflects Smurfit Kappa’s serious commitment to providing the best packaging solutions available,” said Ignacio Sevillano, CEO Smurfit Kappa Spain, Portugal and Morocco. Click Read More below for additional information.

As part of its increased expansion in the Latin American pressure-sensitive label market, UPM Raflatac is pleased to announce it will be opening a new slitting and distribution terminal in Santiago, Chile in early 2018. This new terminal will allow UPM Raflatac to improve its service capabilities and offer an expanded range of paper and film products to customers in the Chilean market, particularly in the wine and craft beverage segments. Currently under construction in the Lo Boza industrial sector adjacent to Santiago International Airport, this brand new facility will join UPM Raflatac's growing Americas Terminal Network, which includes a number of facilities throughout North and South America. The new terminal will feature two meter-wide slitting capabilities and the company plans to have trimless offerings on select materials. Click Read More below for additional detail.